PCB sampling and mass production services from 1 to 42 layers. We use real A-grade plates, adhere to the factory's self-operated production model, and ensure the reliability and stability of quality. Brand new high-rise dedicated production line, the circuit soldering prevention adopts advanced production equipment in the industry such as LDI, VCP pulse plating, etc., uses famous brand plates, precise impedance detection instruments, and provides high-definition characters, high-quality inspection standards, high-end packaging and transportation services.
| Multi-Layers(Partial Technology Capability) | ||
| Layer count | 1~42L | |
| Core thickness（Exclude copper） | 50um | |
| Min mechanical hole size | 100um | |
| Inner outter layer registration Mini pad Dia. | DHS+6mil | |
| Min. S/M dam | 50um | |
| Min. S/M opening size | 4mil | |
| Via Covering | Epoxy Filled & Untented, Epoxy Filled & Capped,Copper paste Filled & Capped | |
| Solder mask color |  |
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| Solder mask ink thickness | ≧10um | |
| Depth-Controlled routing tolerance | ±0.05mm | |
| Minimum Legend Width | 6mil(0.15mm) | |
| Surface Finish |
HASL/ImmersionTin/ImmersionSilver /ImmersionGold/ENEPIG/OSP |
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