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Products
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FPC
Rigid-Flex
FR-4
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USB Cable
Antenna Cable
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RF and Wireless
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News
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News
Optimizing Power Integrity with Embedded Capacitance Technology
2025-04-29 17:04
Introduction As electronic devices evolve toward miniaturization, high-frequency operation, and increased integration, power integrity (PI) has emerged as a critical challenge in high-speed PCB des...
Optimizing Additive Formulation for Void-Free Filling in Through-Hole Plating
2025-04-28 17:01
1. Technical Challenges & Void Formation Mechanisms In HDI PCB and IC substrate manufacturing, void-free plating of micro-vias (e.g., 50μm diameter, 10:1 aspect ratio) faces critical challenges:...
Maintaining Rz<1.5μm in Ultra-Low Profile (VLP) Copper Foil Processing
2025-04-27 23:37
1. Definition & Importance of VLP Copper Foil Ultra-Low Profile (VLP) copper foil requires surface roughness (Rz) 90% reduction) + annealing (Rz=0.8–1.0μm). Surface cleaning: ...
Optimizing Selective Coating Process for Precision Conformal Coating Coverage
2025-04-26 23:20
1. Background & Challenges Precision conformal coating (moisture, dust, and corrosion protection) is critical in electronics manufacturing, especially for complex PCBs. Traditional methods face iss...
SMT BGA Solder Joint Quality Inspection Technology (Part 1)
2025-04-25 11:59
BGA in the development of assembly processes or as an audit mechanism during production, and the inspection techniques used at different stages. The following table provides some recommendations on th...
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