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News
Designing Solder Mask Opening Compensation to Offset Exposure-Development Dimensional Deviation
2025-04-23 16:05
1. Sources of Dimensional Deviation Exposure tool accuracy: Optical distortion (±5μm) and alignment errors. Photoresist properties: Shrinkage (0.1–0.3%) and swelling during...
Designing Stepped Lamination Process to Minimize Interlayer Slip in Hybrid High-Frequency Boards
2025-04-22 23:15
1. Causes of Interlayer Slip Interlayer slip in hybrid boards (e.g., FR-4/PTFE) arises from: CTE mismatch: PTFE (~100 ppm/°C) vs. FR-4 (~14 ppm/°C) thermal expansion； Resin flow...
Maintaining Sidewall Verticality >85° in Ultra-Thick Copper (>6oz) Etching
2025-04-21 17:23
1. Etchant System Optimization High-selectivity etchant formulationUse H₂SO₄-H₂O₂ (3:1 ratio) with 0.5–1.0 g/L benzotriazole (BTA) to reduce side etching by 40–50% compared ...
Setting Drag Angle in Selective Wave Soldering to Prevent Bridging Defects
2025-04-20 21:34
1. Mechanism of Bridging Defects Bridging occurs when solder fails to separate between adjacent joints, primarily due to: Excessive solder: Low drag angle prolongs solder contact time, inhibit...
Controlling PCB Surface Roughness in Gold Wire Bonding Hybrid Assembly
2025-04-18 22:51
1. Critical Impact Mechanisms Surface roughness (Ra) critically affects gold wire bonding performance through: Mechanical interlocking: High Ra (>0.5μm) reduces contact area, decreasing pul...
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