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Home
Products
PCB Product Center
FPC
Rigid-Flex
FR-4
HDI PCB
PTFE Teflon
Rogers
Aluminum
Copper Core
PCB Assembly
Product Rebuild
Testing Service
Certification Application
Transformers
Wire Harness,Cables Customized
Coaxial Cable
Power Cord
Network Cable
USB Cable
Antenna Cable
Components sourcing
Connectors
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Communication Modules
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Switches
Transistors
Power Modules
RF and Wireless
Net Position Indicator
News
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Contact us
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News
Enhancing Electroless Copper Adhesion on PTFE Substrates via Cold Plasma Treatment
2025-04-05 20:38
1. PTFE Surface Challenges PTFE’s low surface energy (18–24 mN/m) and chemical inertness lead to: Weak adhesion: Lack of functional groups for chemical bonding; Poor wettabili...
Cleaning High Aspect Ratio Through-Holes Using Supercritical CO₂ Fluid
2025-04-02 15:24
1. Properties and Advantages of Supercritical CO₂ Supercritical CO₂ (scCO₂) combines gas-like diffusivity (≈10⁻⁷ m²/s) and liquid-like solvation power (solubility parameter&asy...
Repairing PCB Copper Layer Defects via Cold Spray Technology
2025-04-01 22:46
1. Principles and Advantages of Cold Spray Cold Spray is a solid-state deposition process where metal powders (e.g., Cu) are accelerated by high-pressure gas (N₂/He) to supersonic speeds (300&nda...
Eliminating Microbubble Residues in Multilayer Boards via Vacuum Lamination Process
2025-03-31 17:26
1. Causes and Impacts of MicrobubblesMicrobubbles (1–50 μm voids) formed by trapped gas during lamination degrade: Electrical performance: Increased dielectric loss (e.g., +0.005 tan&d...
Suppressing Dog-bone Effect in Ultra-high Aspect Ratio (>20:1) Through-hole Electroplating
2025-03-30 20:50
Dog-bone Effect refers to the phenomenon where the plating thickness at the via entrance and exit is significantly greater than the middle region during high-aspect-ratio through-hole electroplating...
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