| Partial PCB Process Parameters | |
| Base Material | PTFE Teflon |
| Layers | 2Layers |
| Maximum Dimensions | 590mm*438mm |
| PCB Thickness | 0.76mm~1.65mm |
| PCB Color |  |
| Silkscreen |  |
| Material Type |
ZYF255DA(Dk=2.55,Df=0.0018), ZYF265D(Dk=2.65,Df=0.0019), ZYF300CA-C(Dk=2.94,Df=0.0016), ZYF300CA-P(Dk=3.0,Df=0.0018), [Data Sheet] |
| Surface Finish | ENIG |
| Gold Thickness | 1μ'', 2μ'' |
| Outer Copper Weight | 1oz |
| Via Covering | Tented, Untented, Plugged, Epoxy Filled & Capped, Copper Paste Filled & Capped |
| Test | AOI, Flying Probe Test |