List of Common SMT Professional Terminology in Electronics Manufacturing:
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SMT (Surface Mount Technology): A manufacturing process that involves mounting electronic components directly onto the surface of a PCB.
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PCB (Printed Circuit Board): A board used to support and connect electronic components.
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DIP (Dual In-line Package): A common packaging form for electronic components.
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SMD (Surface Mount Device): Electronic components suitable for SMT processes.
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BGA (Ball Grid Array): A high-density packaging technology.
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IC (Integrated Circuit): A device that integrates multiple electronic components onto a single chip.
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PCB Assembly: The process of installing electronic components onto a PCB.
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Reflow Soldering: A soldering process that melts solder by heating to connect electronic components to a PCB.
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AOI (Automated Optical Inspection): Used to inspect the quality of electronic components and solder joints on a PCB.
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X-Ray Inspection: Used to inspect the quality of solder joints inside packages like BGA.
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ICT (In-Circuit Test): Functional testing of electronic components on a circuit board.
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FCT (Functional Test): Functional testing of an entire circuit board or product.
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THT (Through Hole Technology): A process that involves soldering the leads of electronic components through holes in a PCB.
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SMT Line: An SMT production line that includes equipment such as printers, placement machines, and reflow ovens for SMT processes.
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Component Mounting: The process of accurately placing SMD components onto a PCB.
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Stencil Printing: A process that uses a stencil to print solder paste onto a PCB.
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Pick and Place: The action of a placement machine picking up SMD components from a feeder and placing them onto a PCB.
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Solder Paste: A mixture of metal powder and flux used for soldering SMD components.
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Lead-Free Solder: An environmentally friendly solder that does not contain lead.
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Wave Soldering: A process that applies molten solder to a PCB through a wave to solder through-hole components.
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Cleaning: The removal of contaminants and flux residues from a circuit board.
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Quality Control: Ensuring that products meet specified quality standards.
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Yield: The ratio of qualified products to the total production quantity.
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ESD (Electrostatic Discharge): A phenomenon of electrostatic discharge that can damage electronic components.
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Reliability: The ability of a product to function normally under specified conditions.
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PCB Fabrication: The process of manufacturing PCBs, including steps such as design, drilling, and etching.
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Component Lead Forming: Bending the leads of components into shapes suitable for soldering or installation.
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Solder Joint: The welded connection point between an electronic component and a PCB.
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Void: Bubbles or gaps in a solder joint that may affect its quality and reliability.
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PCB Thickness: The thickness dimension of a PCB board.
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Copper Thickness: The thickness of the copper foil on a PCB.
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Impedance Control: Ensuring impedance matching for signal transmission on a PCB.
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RF PCB: A PCB used for high-frequency signal transmission.
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Microvia: A via hole with a diameter less than 0.15mm on a PCB.
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Blind Via: A via hole that connects only internal layers of a PCB.
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Buried Via: A via hole that is completely embedded within a PCB.
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PCB Material: Materials commonly used for PCBs include FR-4, Rogers, etc.
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SMT Component Feeder: A feeder that provides SMD components to a placement machine.
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Nozzle: The suction nozzle of a placement machine used to pick up and place SMD components.
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Feeder Calibration: Calibration of the feeder to ensure accurate feeding of SMD components.
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Component Placement Accuracy: The positional deviation of a component placed by a placement machine.
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Reflow Profile: The temperature profile inside a reflow oven, indicating the variation of temperature with time, which affects the quality of soldering.
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Solderability: The ability of an electronic component's lead or PCB pad to be soldered.
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Flux: A chemical substance used to promote soldering.
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Solder Spatter: Small particles of solder that are splashed during the soldering process.
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Tombstoning: A phenomenon where SMD components stand upright after soldering.
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Component Shift: The deviation of a component's position after placement from its designed position.
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PCB Warpage: The bending or deformation of a PCB board.
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SMT Production Line: The entire process of SMT production, including printing, placement, reflow soldering, and other steps.
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Cycle Time: The time required to complete a production process.
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SMT Stencil: A template used for printing solder paste.
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Adhesive: A substance used to secure SMD components in position on the PCB.
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Component Packaging: The appearance and pin arrangement of an electronic component.
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QFN (Quad Flat No-Lead): A type of surface-mounted package with no external leads.
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SOP (Small Outline Package): One of the common integrated circuit packages.
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SOJ (Small Outline J-lead Package): A small outline package with J-shaped leads.
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PLCC (Plastic Leaded Chip Carrier): A plastic package with leads for chip carriers.
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PGA (Pin Grid Array): A package with pins arranged in a grid pattern.
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COB (Chip-on-Board): A packaging method where the chip is directly mounted on the PCB.
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Wire Bonding: A technique to connect a chip to a PCB or package substrate using wires.
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Flip Chip: A technique where the active side of the chip is attached to the PCB or substrate facing down.
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Underfill: A material used to fill the gap between a chip and the PCB to enhance reliability.
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PCB Design: The process of designing PCBs, including layout, routing, signal integrity, etc.
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Gerber File: A graphical file format required for PCB manufacturing.
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DFM (Design for Manufacturing): A PCB design approach that considers manufacturing processes.
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NPI (New Product Introduction): The process of introducing a new product into production.
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BOM (Bill of Materials): A list of raw materials and components required for a product.
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MOQ (Minimum Order Quantity): The minimum purchase quantity required by a supplier.
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JIT (Just-in-Time): A production strategy that produces and supplies components based on actual demand.
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Kanban: A signaling system used to control production processes.
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Cost of Goods Sold: The direct costs incurred in producing goods for sale.
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ROI (Return on Investment): A metric used to evaluate the efficiency of an investment.
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ERP (Enterprise Resource Planning): A system that integrates enterprise management information.
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MES (Manufacturing Execution System): Software used to monitor and manage production processes in real-time.
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Six Sigma: A quality management methodology aimed at reducing defects and improving process stability.